SEMI-THERM 2017 : Preview

Posted on: Thursday February 23, 2017

Show : SEMI-THERM 33rd Annual Symposium & Exhibition

Date : March 14th (Tuesday) to 15th (Wednesday), 2017

Location : Doubletree by Hilton San Jose, California

Hall : Bayshore Ballroom

Booth : 403

Booth Name : LISAT

SEMI-THERM is the premier symposium on thermal design, management and characterization of electronic components and systems. It is an event that is dedicated to the thermal solution and management industry.

The exhibition is a central part of our events schedule and with over 30 years of successful symposiums and exhibitions, SEMI-THERM continues to be the choice for providers of products and services related to thermal management of all scales, from semiconductors, RF, LED, solar / PV, PCB and box systems to network equipment and facilities.

It is a gathering of thermal engineers from all over the industry. Attendees include anyone interested in thermal design, management and characterization of electronic systems and components. SEMI-THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services.

LISAT, a leading manufacturer of Thermal Interface Material (TIM) and EMI material will be displaying our products at the show. On display, will be LISAT materials ranging from 1W/m-K to 7W/m-K. Material thickness ranging from 0.25mm to 15.00mm will also be put up on display.

EMI Shielding Paint (ESP), a new product by LISAT, will be introduced at the show. It is a chemical coating paint that can be used to shield Electro Magnetic Interference (EMI). It has an EMI shielding efficiency range from 15MHz to 20GHz and wide. This coating paint can be easily applied onto the internal and external surfaces of articles for protection of EMI. Typical application include Electrical, Electronics, IT Products, Medical Devices, Telecommunication Systems, Aerospace, Avionics and Electric Trains.

All are welcome to visit us at the above booth.

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