LST TIG 835 (3.5 W/m-K)

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LISAT LST-TIG-835 is a two-part, ultra-high performance and thermally conductive, liquid gap filling material. It can be cured at room temperature and by accelerated heat. The material is an excellent solution for interfacing fragile component with high topography or stack-up tolerances to a universal heat sink or housing. Once cured, Gap Filler LST-TIG-835 remains a low modulus elastomer that helps relive CTE stress during thermal cycling and yet maintains enough modulus to prevent pump out from the interface.

Features

✓ Thermal Conductivity : 3.5W/m-K

✓ Easy to Dipense

✓ Excellent Slump Resistance

✓ Good Wet-out for low stress interface

✓ 100% Solid-no cure by-products

✓ Good Mechanical & Chemical Stability

*Maximizes Dispensing capacity and equipment reliability

Typical Application

@ Automotive Electronics

@ Computer Peripherals

@ Telecommunications

@ Thermally Conductive Vibration Dampening

@ PCBA to Housing

@ Discrete Component to Heat Spreader

Properties

Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.

835