LST TIG 820 (2.5 W/m-K)
LISAT LST-TIG-820 is a two-part, high performance thermally conductive and liquid gap filling material. It can be cured at room temperature with accelerated heat . The material provides a balance of cured material properties and good compression set (memory). Once cured, Gap Filler LST-TIG-820 provides a soft contact with good thermally conductive form-in-place elastomer that is ideal for coupling “hot” electronics components mounted on PC Board with an adjacent metal case or heat sink.
✓ Thermal Conductivity : 2.5W/m-K
✓ Stress Absorping Flexibility
✓ Excellent Slump Resistance
✓ Good Wet-out for low stress interface
✓ 100% Solid-no cure by-products
✓ Good Mechanical & Chemical Stability
*Maximizes Dispensing capacity and equipment reliability
@ Automotive Electronics
@ Computer Peripherals
@ Thermally Conductive Vibration Dampening
@ PCBA to Housing
@ Discrete Component to Heat Spreader
Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.