LST TIG 820 (2.5 W/m-K)

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LISAT LST-TIG-820 is a two-part, high performance thermally conductive and liquid gap filling material. It can be cured at room temperature with accelerated heat . The material provides a balance of cured material properties and good compression set (memory). Once cured, Gap Filler LST-TIG-820 provides a soft contact with good thermally conductive form-in-place elastomer that is ideal for coupling “hot” electronics components mounted on PC Board with an adjacent metal case or heat sink.

Features

✓ Thermal Conductivity : 2.5W/m-K

✓ Stress Absorping Flexibility

✓ Excellent Slump Resistance

✓ Good Wet-out for low stress interface

✓ 100% Solid-no cure by-products

✓ Good Mechanical & Chemical Stability

*Maximizes Dispensing capacity and equipment reliability

Typical Application

@ Automotive Electronics

@ Computer Peripherals

@ Telecommunications

@ Thermally Conductive Vibration Dampening

@ PCBA to Housing

@ Discrete Component to Heat Spreader

Properties

Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.

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