LST TIG 820 (2.5 W/m-K)

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LISAT LST-TIG-820 is a two-part, high performance thermally conductive and liquid gap filling material. It can be cured at room temperature with accelerated heat . The material provides a balance of cured material properties and good compression set (memory). Once cured, Gap Filler LST-TIG-820 provides a soft contact with good thermally conductive form-in-place elastomer that is ideal for coupling “hot” electronics components mounted on PC Board with an adjacent metal case or heat sink.