LST TIP 370 (7.0W/m-K)


LISAT LST-TIP-370 is another material of high thermal conductivity with relatively low pressure that can achieve low interfacial thermal resistance. Applied to power devices and heat sink between aluminum or machine casing, it can effectively remove air to achieve a good filling effect. LST-TIP-370 has good withstand voltage characteristics and temperature stability, making it a safe and reliable material. LST-TIP-370 has a super good soft performance with glass fiber reinforced that will help to reduce structural stress and provide a protective effect on the chip and its operating performance.


✓ High Thermal Conductivity - 7.0 W/m-k

✓ Low Thermal Impedance

✓ Good Electrical Insulator

✓ Soft and Good Surface Wetting Properties

✓ Electrically Isolating

✓ Wide Thickness Range

Typical Application

@ Telecommuncations

@ Multimedia Products

@ CPU, GPU, VGA High Power Chips

@ Automotive Electronic Products

@ LED Heat Management Solutions

@ Solar Panel Management Solutions



Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.