LST TIP 217 (7.0W/m-K)


LISAT LST-TIP-217 is another material of high thermal conductivity with relatively low pressure that can achieve low interfacial thermal resistance. Applied to power devices and heat sink between aluminum or machine casing, it can effectively remove air to achieve a good filling effect. LST-TIP-217 has good withstand voltage characteristics and temperature stability, making it a safe and reliable material. LST-TIP-217 has a super good soft performance with glass fiber reinforced that will help to  reduce structural stress and provide a protective effect on the chip and its operating performance.


✓ High Thermal Conductivity - 7.0 W/m-k

✓ Low Thermal Impedance

✓ Good Electrical Insulation

✓ Soft and good surface wetting properties

✓ Elasticity for reliable long term work

✓ Wide Thickness Range

Typical Application

@ Telecommunication

@ Multimedia Product

@ CPU, GPU, VGA high power chips

@ Automotive Electronics Products


@ LED Light and Heat Management

@ Solar Panel Heat Management Solutions


Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.