LST TIP 214 (5.0W/m-K)


LISAT LST-TIP-214, with its ultra-high thermal conductivity and a relatively low pressure, is a material that can achieve low interfacial thermal resistance. Applied to power devices and heat between aluminum or machine casing, it can effectively remove air to achieve a good filling effect. It has a good withstand voltage characteristic and temperature stability thus making it a safe and reliable material. LST-TIP-214 has good flexibility, performance, resilience and is able to help to reduce structural stress and protect the chips.


✓ Ultra High Thermal Conductivity - 5.0 W/m-k

✓ Low Thermal Impedance

✓ Good Electrical Insulation

✓ Soft and good surface wetting properties

✓ Elasticity for reliable long term work

✓ High AC Withstand Voltage Value

✓ Wide Thickness Range

Typical Application

@ Telecommunication

@ Multimedia Product

@ CPU, GPU, VGA high power chips

@ Network Terminal

@ Security Equipment

@ LED Light and Heat Management

@ Solar Panel Heat Management Solutions


Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.