LST TIP 211 (1.3W/m-K)

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LISAT LST-TIP-211, a thermally conductive material, has an average compression rate which is designed for applications that require a minumun amount of pressure on component. This product can be use as an interface where one side of the Thermal Pad is in contact with a leaded components. The conformable nature of the Thermal Pad allows the Pad to fill up the air gaps between the heat sinks or metal box or components or Printed Circuit Board.