LST TIP 211 (1.1W/m-K)

LISAT LST-TIP-211, a thermally conductive material, has an average compression rate which is designed for applications that require a minumun amount of pressure on component. This product can be use as an interface where one side of the Thermal Pad is in contact with a leaded components. The conformable nature of the Thermal Pad allows the Pad to fill up the air gaps between the heat sinks or metal box or components or Printed Circuit Board.


✓ Thermal conductivity of 1.3 W/m-K

✓ Low thermal impedance

✓ Good electrical insulation

✓ Electrically isolating

✓ Soft and good surface wetting properties

✓ Elasticity for reliable long term work

✓ Low hardness

✓ Wide thickness range

Typical Application

@ Telecommunication & Network device thermal management solution

@ Computer, Multimedia and Peripherals

@ Power Conversion

@ CPU, GPU, VGA high power chips

@ LED heat management solution

@ Display equipment cooling application

@ Automotive electronics cooling solution


Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.