LST TIP 206 (1.5W/m-K)

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LISAT LST-TIP-206 a Thermal Pad material, with excellent thermal conductivity and surface wetting ability, it is able to produce good performance. The material softness is ideal to achieve low interface thermal impedance at a low pressure level and yet optimazing its thermal performance. With good recoverability and ability to ensure a reliable contact, this will allow effective thermal dissipation from heat source through filled gap by removing air to its best performance.

Features

✓ Thermal conductivity of 1.5 W/m-K

✓ Low thermal impedance

✓ Good electrical insulation

✓ Soft and good surface wetting properties

✓ Elasticity for reliable long term work

✓ Wide thickness range

Typical Application

@ CPU, GPU, VGA high power chips

@ Rechargeable battery & Solar Panel invertor heat management solution

@ LED heat management solution

@ Display equipment cooling application

@ Automotive electronics cooling solution

@ Telecommunication & Network device thermal management solution

Properties

Note : Below technical data and information should be thought as typical or representative only and should not be use for specification purpose.

206